High-Density Integrated Electrocortical Neural Interfaces: Low-Noise Low-Power System-on-Chip Design Methodology
Autor Sohmyung Ha, Chul Kim, Patrick P. Mercier, Gert Cauwenberghsen Limba Engleză Paperback – 6 aug 2019
These methodologies present a path towards the development of minimally invasive brain-computer interfaces capable of resolving microscale neural activity with wide-ranging coverage across the cortical surface.
- Written by leading researchers in electrocorticography in brain-computer interfaces
- Offers a unique focus on neural interface circuit design, from electrode to interface, circuit, powering, communication and encapsulation
- Covers the newest ECoG interface systems and electrode interfaces for ECoG and biopotential sensing
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Specificații
ISBN-13: 9780128151150
ISBN-10: 0128151153
Pagini: 210
Dimensiuni: 191 x 235 mm
Greutate: 0.37 kg
Editura: ELSEVIER SCIENCE
ISBN-10: 0128151153
Pagini: 210
Dimensiuni: 191 x 235 mm
Greutate: 0.37 kg
Editura: ELSEVIER SCIENCE
Public țintă
Biomedical engineers, students and researchers in electrical/electronic engineering and circuit designCuprins
1. Introduction to ECoG and ECoG Interfaces
2. Electrode-to-Brain Interfaces
3. Integrated Circuit Interfaces for Data Acquisition
4. Integrated Circuit Interfaces for Stimulation
5. Power Management for mm-sized ECoG Implants
6. RF Power Transfer and its Considerations
7. Wireless Data Communication
8. Fully Integrated Modular ECoG Recording and Stimulation
2. Electrode-to-Brain Interfaces
3. Integrated Circuit Interfaces for Data Acquisition
4. Integrated Circuit Interfaces for Stimulation
5. Power Management for mm-sized ECoG Implants
6. RF Power Transfer and its Considerations
7. Wireless Data Communication
8. Fully Integrated Modular ECoG Recording and Stimulation