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Failure-Free Integrated Circuit Packages

Autor Charles Cohn, Charles A Harper
en Limba Engleză Hardback – 17 aug 2004
The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.
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Specificații

ISBN-13: 9780071434843
ISBN-10: 0071434844
Pagini: 363
Dimensiuni: 156 x 237 x 32 mm
Greutate: 0.69 kg
Editura: McGraw Hill LLC
Locul publicării:United States

Cuprins

Chapter 1 Introduction

Chapter 2 Fundamentals of IC Package Technologies

Chapter 3 Device Reliability

Chapter 4 Physics and Chemistry of Failures in Packaged Devices

Chapter 5 Strategies for Locating Failures

Chapter 6 Failure Analysis Techniques

Chapter 7 Examples of Failure Modes Common in Organic IC Packages

Chapter 8 Emerging Assembly Materials for IC Packaging

Index