Cărți de C.P. Wong

Materials for Advanced Packaging

Editat de Daniel Lu et al.

10 dec 2008

Preț: 1084^.95 lei 1323^.11 lei

6-8 săpt.

-18%

Nano-Bio- Electronic, Photonic and MEMS Packaging

Editat de C.P. Wong et al.

sep 2014

Preț: 1274^.66 lei 1765^.99 lei

Indisponibil temporar

-28%

Advanced Flip Chip Packaging

Editat de Ho-Ming Tong et al.

21 mar 2013

Preț: 1194^.92 lei 1457^.21 lei

6-8 săpt.

-18%

Electrical Conductive Adhesives with Nanotechnologies

Autor Yi (Grace) Li et al.

5 sep 2014

Preț: 682^.96 lei 886^.96 lei

Indisponibil temporar

-23%